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High-Linearity, 1700MHz to 3000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
be applied to V CC before digital logic is applied to
LOSEL (see the Absolute Maximum Ratings ). LO1 and
LO2 inputs are internally matched to 50 ? , requiring
only a 22pF DC-blocking capacitor.
A two-stage internal LO buffer allows a wide-input power
range for the LO drive. The on-chip low-loss balun,
along with an LO buffer, drives the double-balanced
mixer. All interfacing and matching components from
the LO inputs to the IF outputs are integrated on chip.
High-Linearity Mixer
The core of the MAX2041 is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO buffer.
Differential IF
The MAX2041 mixer has an IF frequency range of DC to
350MHz. Note that these differential ports are ideal for
providing enhanced IIP2 performance. Single-ended IF
applications require a 1:1 balun to transform the 50 ? dif-
ferential IF impedance to a 50 ? single-ended system.
After the balun, the IF return loss is better than 15dB.
The differential IF is used as an input port for upconvert-
er operation. The user can use a differential IF amplifier
following the mixer but a DC block is required on both IF
pins. In this configuration, the IF+ and IF- pins need to
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower-level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX2041 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin and
TAP with the capacitors shown in the Typical
Application Circuit; see Table 1. Place the TAP bypass
capacitor to ground within 100 mils of the TAP pin.
Table 1. Component List Referring to the
Typical Application Circuit
be returned to ground through a high resistance (about
1k ? ). This ground return can also be accomplished by
grounding the RF TAP (pin 3) and AC-coupling the IF+
and IF- ports (pins 19 and 18).
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50 ? . No
COMPONENT
C1
C4
C2, C6, C7, C8,
C10, C12
C3, C5, C9, C11
R1
VALUE
4pF
10pF
22pF
0.01μF
549 ?
DESCRIPTION
Microwave capacitor (0603)
Microwave capacitor (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
±1% resistor (0603)
matching components are required. Return loss at the RF
port is typically better than 17dB over a 1400MHz to
3000MHz frequency range, and return loss at the LO
ports is typically better than 16dB over a 1900MHz to
3000MHz frequency range. RF and LO inputs require
only DC-blocking capacitors for interfacing.
T1
U1
IF balun with DC grounded
1:1 Balun ports
M/A-COM MABAES0029
MAX2041 Maxim IC
The IF output impedance is 50 ? (differential). For eval-
uation, an external low-loss 1:1 (impedance ratio) balun
transforms this impedance to a 50 ? single-ended out-
put (see the Typical Application Circuit ).
Bias Resistor
Bias current for the LO buffer is optimized by fine tun-
ing resistor R1. If reduced current is required at the
expense of performance, contact the factory for details.
If the ±1% bias resistor values are not readily available,
substitute standard ±5% values.
Exposed Pad RF/Thermal Considerations
The EP of the MAX2041 ’ s 20-pin thin QFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the MAX2041 is
mounted be designed to conduct heat from the EP. In
addition, provide the EP with a low-inductance path to
electrical ground. The EP MUST be soldered to a
ground plane on the PC board, either directly or
through an array of plated via holes.
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